A group of students from the Faculty of Engineering participated in an industrial visit to Amkor Technologies Malaysia Sdn. Bhd in June 2024. Organized by the Industrial Linkage Committee (ILC) of the faculty, the visit kicked off with a comprehensive safety briefing by Ms. Khairani, followed by warm welcoming remarks from Ms. Rahimah, the senior Human Resource Manager.
The students were briefed on the company’s background by Mr. Tan Chee Eng, the Director of the Power Products Business Unit. He provided detailed insights into power packaging, assembly, and testing processes. Mr. Tan also elaborated on the wafer dicing, screen printing of solder paste, aluminum wedge bonding, optical vision inspection, and ULT traceability.
The tour included visits to various specialized labs such as the dicing, assembly and packaging, handling and test, and power packaging labs, offering students a hands-on glimpse into the semiconductor industry. The visit concluded with refreshments and a group photo session, creating lasting memories. It also provided invaluable insights, bridging academic knowledge with real-world industry practices and equipping students with practical skills for their future careers as engineers.
